silicon die
英 [ˈsɪlɪkən daɪ]
美 [ˈsɪlɪkən daɪ]
网络 硅芯片; 没有硅片; 要减少硅芯片; 硅芯片模; 硅片
双语例句
- Hidden among all the Silicon Valley success stories there are hundreds more companies that fail to catch the next wave and die.
硅谷成功的公司并不少见，但是鲜为人知的是，更多的公司因为未能抓住下一波科技潮流而最终灭亡。 - An aluminum silicon die cast alloy having a very low iron content and relatively high strontium content that prevents soldering to dies into die casting process.
一种铝硅模铸合金，具有非常低的铁含量和相对较高的锶含量，用来防止在模铸过程中焊接在模具上。 - Earlier in the year, Intel demonstrated that a laser could be fabricated in silicon as well, but Luxtera's solution allows the laser to be fabricated on a separate die.
今年早些时候，Intel展示了如下结果：在硅上可以制作激光器件，但Luxtera的解决方案可以让激光器在另一块单独的芯片上制造。 - Cold quasi-isostatic molding with a silicon rubber die was used for manufacturing the spherical fuel elements of 10 MW high temperature gas-cooled reactor.
10MW高温气冷实验堆球形燃料元件的制造使用橡胶模具冷准等静压工艺。 - Actual Example Analysis about Wire Cutting Method of Motorcycle Start Electrical Machinery Rotor Silicon Steel Board Raised Hollow Mould Then the structure and machining for die centre in-layed piece are illustrated in detail.
摩托车启动电机转子硅钢片凸凹模芯线切割加工分析对冷挤压模具结构及工作原理、凹模芯的设计及加工也做了详细介绍。 - Study on Material Determination of Silicon Steel Sheet Cool Punching Concave Die and Compound Intensifying Processing
硅钢片冷冲凹模的选材与复合强化处理研究 - The failure cause was analyzed and the heat treatment process was improved was improved for silicon steel cold punching die. The practise proof: improving of forging process and adopting of cryogenic treatment after quenching can increase remarkably the service life of the die.
对硅钢片冷冲模进行了失效分析且对其热处理工艺进行了改进，实践证明：改进锻造工艺及淬火后采用深冷处理等方法可显著提高模具的使用寿命。 - It is proved by tests done on test rig that the bonding between silicon nitride ceramic insert block and rocker body by aluminum alloy die casting is reliable.
通过台架试验证明，采用铝合金压铸将氮化硅陶瓷镶块与摇臂基体连接的方法是可靠的。 - It is also necessary to do thermo-mechnical modeling of thermal through silicon via ( TTSV) and thin stack die ( including adhesive and interposer) and the impact on active devices and interconnect.
有必要进行热硅通孔和薄的堆叠晶片（包括粘结层或者中介层）的热-力建模及其对有源器件和互连线影响的研究。